ERI Summit 2019: Domain-Specific System on Chip (DSSoC)

Dr. Tom Rondeau, Program Manager, DARPA MTO

Dr. Sarita Adve, Professor of Computer Science, University of Illinois at Urbana-Champaign

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

MTO Office Panel: Sensors and the Electromagnetic Spectrum

Effective land, sea, air, space, and cyber-based combat operations require deep connections between the physical and digital domains. DoD systems often develop an accurate picture of the physical world, transmit sensor data across the electromagnetic spectrum, digitally process that data to enable smart decisions, and then conduct multi-actor operations aligned with decision-maker needs. MTO enables this interaction between the physical and digital worlds by recognizing the need for extensive and diverse sensor arrays, creating power-efficient hardware for real-time data fusion and exploitation, and developing systems that adapt to changes in the spectrum such as unfamiliar jamming and spoofing techniques. Program Managers discuss MTO’s vision for the future of networked operations. Discussion techniques include radio frequency, optical, and other low-footprint hardware for assured connectivity; options for enabling positioning, navigation, and timing with limited spectrum access; and electronics capabilities for ubiquitous sensing.

Moderator
Dr. Jay Lewis – DARPA, MTO

Panelists
Dr. John Burke – DARPA, MTO
Dr. Timothy Hancock – DARPA, MTO
Dr. Gordon Keeler – DARPA, MTO
Dr. Whitney Mason – DARPA, MTO
Dr. Ronald Polcawich – DARPA, MTO
Dr. Tom Rondeau – DARPA, MTO