DARPA ERI Summit 2018: The Intertwined History of DARPA & Moore’s Law

DARPA ERI Summit 2018: The Intertwined History of DARPA & Moore’s Law
Dr. William Chappell, Director, Microsystems Technology Office, DARPA
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.
Dr. William Chappell gives an overview of DARPA’s Electronics Resurgence Initiative, including a discussion of previous programs, new programs, and the importance of Gordon Moore’s seminal 1965 paper.

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative

DARPA ERI Summit 2018: The DARPA Mission

DARPA ERI Summit 2018: The DARPA Mission
Dr. Steven Walker, DARPA Director
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative

DARPA ERI Summit 2018: New Commercial DoD Partnership Models

DARPA ERI Summit 2018: New Commercial DoD Partnership Models
Mr. Tom Beckley, Senior Vice President & GM of Custom IC & PCB Group, Cadence Design Systems
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative

DARPA ERI Summit 2018: Next Wave of Electronics-Driven Applications

DARPA ERI Summit 2018: Next Wave of Electronics-Driven Applications
Dr. Walden Rhines, Chief Executive Officer, Mentor Graphics

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative

DARPA ERI Summit 2018: The Accelerator Age

DARPA ERI Summit 2018: The Accelerator Age
Dr. Bill Dally, Chief Scientist & Senior Vice President, NVIDIA
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative

DARPA ERI Summit 2018: The End of Moore’s Law & Faster General Purpose Computing, & a New Golden Age

DARPA ERI Summit 2018: The End of Moore’s Law & Faster General Purpose Computing, and a New Golden Age
Dr. John Hennessy, Chairman, Alphabet
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative

DARPA ERI Summit 2018: The Future is So Bright – the Era of Heterogeneous Compute

DARPA ERI Summit 2018: The Future is So Bright – the Era of Heterogeneous Compute
Dr. Mike Mayberry, CTO, Intel
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative

Altering the Foundation of Our Digital Society

Our computation demands now are different from those in the 20th century. New workloads extend from sensing and communication at the fringe of the Internet of Things to real-time scene analysis in autonomous vehicles to machine learning and inference in huge data centers. In all cases, efficiency is critical: low power, low cost, and small size.

Given these new application domains, and admitting that we can no longer rely on CMOS scaling to bury our problems under a mountain of cheap transistors, what are our options? DARPA has invested in alternative architectures such as neuromorphic computing to develop novel alternatives in base technology, circuits and systems that could continue to deliver greater computational power at much greater efficiency. Why have they not changed the industry (yet)? Where and how will they be deployed? Do our new artificial intelligence workloads open the door to novel computational circuits and systems? What will industry do and what will DARPA do to make the 21st century compute engines to address 21st century compute problems?

Moderator
Dr. Stephen Trimberger – DARPA, Microsystems Technology Office (MTO)

Panelists
Dr. Doug Burger – Microsoft Research NExT
Dr. Dan Hammerstrom – Portland State University
Dr. Carver Mead – California Institute of Technology

DARPA ERI Summit 2018: Another Brick in the Wall

DARPA ERI Summit 2018: Another Brick in the Wall
Dr. Erica Fuchs, Professor, Engineering and Public Policy, Carnegie Mellon University

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative