ERI Summit 2019: Dr. Rich Uhlig, Managing Director, Intel Labs

From Labs to Impact

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Real Time Machine Learning (RTML) – DARPA / NSF Collaboration

Mr. Andreas Olofsson, Program Manager, DARPA MTO
Dr. Sankar Basu, Program Director, National Science Foundation (NSF)

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Future Technology: Software Defined Hardware (SDH)

Dr. David Wentzlaff, Associate Professor of Electrical Engineering, Princeton University

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Circuit Realization at Faster Timescales (CRAFT)

Dr. Linton Salmon, Program Manager, DARPA MTO
Dr. Brucek Khailany, Director of ASIC and VLSI Research, NVIDIA

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Dr. Robert Sadowski, Robotics Senior Research Scientist, U.S. Army TARDEC

Tank Automotive Research, Development and Engineering Center

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Framework for Novel Compute (FRANC)

Dr. Young-Kai Chen, Program Manager, DARPA MTO

Dr. Naresh Shanbhag, Professor of Electrical Engineering, University of Illinois at Urbana-Champaign

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Domain-Specific System on Chip (DSSoC)

Dr. Tom Rondeau, Program Manager, DARPA MTO

Dr. Sarita Adve, Professor of Computer Science, University of Illinois at Urbana-Champaign

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Space Applications / Future Technology: Domain Specific System on Chip (DSSoC)

Dr. Jesse Mee, Deputy Program Manager, Space Electronics Technology, Air Force Research Laboratory (AFRL)

Dr. Mark Horowitz, Professor of Electrical Engineering and Computer Science, Stanford University

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Mr. John Neuffer, President, Semiconductor Industry Association (SIA)

An Industry Perspective on Government Action

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Dr. Praveen Pilly, Senior Researcher, HRL Laboratories

Future Technology: Lifelong Learning Machines (L2M)

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Secure Systems: Voting / Future Technology: SSITH

Dr. Joe Kiniry, Principal Scientist, Galois

Dr. Todd Austin, Professor of Electrical Engineering and Computer Science, University of Michigan

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Hierarchical Identify Verify Exploit (HIVE)

Mr. Wade Shen, Program Manager, DARPA I2O / MTO

Dr. Saman Amarasinghe, Professor of Electrical Engineering and Computer Science, MIT

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Dr. Ilan Gur, Executive Director, Cyclotron Road

Revitalizing Hard Tech Innovation

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Dr. Tim Talty, Technical Fellow, General Motors

Automotive Applications

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Mr. Mark Ryland, Director, Office of the CISO, Amazon Web Services (AWS)

Future of the Cloud

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Dr. William Chappell, CTO, Microsoft Azure Global

Why Detroit?

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Opening Video

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

DARPA ERI Summit 2018: The Intertwined History of DARPA & Moore’s Law

DARPA ERI Summit 2018: The Intertwined History of DARPA & Moore’s Law
Dr. William Chappell, Director, Microsystems Technology Office, DARPA
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.
Dr. William Chappell gives an overview of DARPA’s Electronics Resurgence Initiative, including a discussion of previous programs, new programs, and the importance of Gordon Moore’s seminal 1965 paper.

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative

DARPA ERI Summit 2018: The DARPA Mission

DARPA ERI Summit 2018: The DARPA Mission
Dr. Steven Walker, DARPA Director
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.

ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.

More information about DARPA
https://www.darpa.mil/

Learn more about ERI
https://www.darpa.mil/work-with-us/electronics-resurgence-initiative