ERI Summit 2020: Day 3 Welcome and Introductory Remarks and Fireside Chats

Welcome and Introductory Remarks
Dr. Dev Palmer, Deputy Director, DARPA Microsystems Technology Office (MTO)

Fireside Chat
Mr. Simon Segars, CEO, Arm
Hon. Stephen Welby, Executive Director, IEEE

Fireside Chat
Ms. Nicole Petta, Principal Director for Microelectronics, OUSD(R&E)
Mr. Richard-Duane Chambers, Special Assistant to the DARPA Director for ERI

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: Microelectronics Security and Access, Part 1

Plenary Presentation
Mr. Brian Connolly, Vice President and Senior Chief Engineer for Cyber Systems, Boeing

Zero Trust Quantifiable Assurance (Related Program: OMG)
Dr. Ken Plaks, DARPA
Dr. Ralph Nyffenegger, KLA-Tencor
Ms. Christine Rink, The Aerospace Corporation

The Future of Secure Systems (Related Program: SSITH)
Mr. Keith Rebello, DARPA
Dr. Brian Uhlhorn, Lockheed Martin

Manufacturing Integrity Lightning Talk
Mr. Keith Rebello, DARPA

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: Technical Leadership Panel

Technical Leadership Panel
Dr. Michael (Mike) C. Mayberry, Chief Technology Officer, Intel Corporation
Dr. Ahmad Bahai, Senior Vice President and Chief Technology Officer, Texas Instruments
Ms. Annabel Flores, Vice President of Electronic Warfare Systems, Raytheon Intelligence & Space
Mr. Doug Bostrom, Vice President of Engineering for Infrastructure and Defense Products, Qorvo
Mr. David Anderson, CEO, SEMI Americas (Moderator)

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: Artificial Intelligence, Autonomy, and Processing

Plenary Presentation
Mr. Gilman Louie, Commissioner, National Security Commission on Artificial Intelligence (NSCAI)

AI To Revolutionize Radios and Communications (Related Programs: FRANC, PEACH, HyDDENN)
Dr. Y.K. Chen, DARPA
Dr. Jan M. Rabaey, University of California Berkeley
Dr. Silvija Filipovic, Perspecta Labs
Dr. Sudhakar Pamarti, University of California Los Angeles

Lifelong Learning Systems (Related Program: L2M)
Mr. Ted Senator, DARPA
Dr. Eric Eaton, University of Pennsylvania

Ferroelectronics Lightning Talk
Dr. Ali Keshavarzi, DARPA

Quantum Inspired Algorithms Lightning Talk
Dr. Bryan Jacobs, DARPA

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: Microelectronics Security and Access, Part 2

Open Source Accelerated Chip Design (Related Programs: POSH, IDEA)
Mr. Serge Leef, DARPA
Prof. Andrew Kahng, University of California San Diego
Prof. Pierre-Emmanuel Gaillardon, University of Utah

Secure Silicon Lightning Talk (Related Program: AISS)
Mr. Serge Leef, DARPA

Homomorphic Encryption Lightning Talk (Related Program: DPRIVE)
Dr. Tom Rondeau, DARPA

Protecting High Risk Transactions Lightning Talk (Related Program: GAPS)
Mr. Walter Weiss, DARPA

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: Day 2 Welcome and Introductory Remarks and Executive Leadership Panel

Welcome and Introductory Remarks
Dr. Mark Rosker, Director, DARPA Microsystems Technology Office (MTO)

Executive Leadership Panel
Dr. Thomas A. Kennedy, Executive Chairman, Raytheon Technologies
Mr. Bill Vass, Vice President of Engineering, Amazon Web Services (AWS)
Mr. Steven Levy, Journalist & Editor at Large, Wired (Moderator)

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: MTO 101 and ERI Program Manager Panel

MTO 101 and Q&A
Dr. Mark Rosker, DARPA
Dr. Dev Palmer, DARPA

ERI Program Manager Panel
Program Managers Young-Kai Chen, Bryan Jacobs, Tom Kazior, Gordon Keeler, Ali Keshavarzi, Serge Leef, and Keith Rebello. Moderated by Dev Palmer.

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: Day 3 Welcome and Introductory Remarks and Fireside Chats

Welcome and Introductory Remarks
Dr. Dev Palmer, Deputy Director, DARPA Microsystems Technology Office (MTO)

Fireside Chat
Mr. Simon Segars, CEO, Arm
Hon. Stephen Welby, Executive Director, IEEE

Fireside Chat
Ms. Nicole Petta, Principal Director for Microelectronics, OUSD(R&E)
Mr. Richard-Duane Chambers, Special Assistant to the DARPA Director for ERI

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: Government Microelectronics Panel

Government Microelectronics Panel
Hon. Ellen Lord, Under Secretary of Defense for Acquisition and Sustainment (A&S)
Hon. Adam Boehler, CEO, International Development Finance Corporation
Dr. Jeffrey Nadaner, Deputy Assistant Secretary of Defense for Industrial Policy

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: MTO 101 and MTO Symposium Panel

MTO 101 and Q&A
Dr. Mark Rosker, DARPA

MTO Symposium Panel
Program Managers Dave Abe, John Burke, John Davies, Ben Griffin, Tim Hancock, Whitney Mason, and Ron Polcawich. Moderated by Mark Rosker.

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: Heterogeneous 3D Microsystems: Design, Fabrication, and Packaging

Plenary Speaker
Dr. Philip Wong, Vice President of Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC); Professor, Stanford

Co-packaging Heterogeneous Microelectronics and Optical Input/Output (Related Programs: CHIPS, PIPES, Navy: SHIP)
Dr. Gordon Keeler; DARPA
Mr. Sergey Shumarayev, Intel
Dr. Mark Wade, Ayar Labs
Mr. Brett Hamilton, Naval Surface Warfare Center (NSWC) Crane

3D Heterogeneous Integration and the Future of Data-Centric Computing (Related Program: 3DSoC)
Dr. Jason Woo, University of California Los Angeles
Dr. Max Shulaker, Massachusetts Institute of Technology

CMOS-Like Heterogeneous Integration Lightning Talk
Dr. Tom Kazior, DARPA

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: 5G and Future RF Communications

Plenary Presentation
Brigadier General Robert Collins, Program Executive Officer, Army Command Control Communications – Tactical (PEO-C3T)

Next Generation Phased Arrays (Related Program: MIDAS)
Dr. Tim Hancock, DARPA
Mr. Lawrence Kushner, Raytheon

Specialized Compute (Related Program: DSSoC)
Dr. Tom Rondeau, DARPA
Prof. Daniel Bliss, Arizona State University
Dr. Michael Zatman, Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E))

RF Emulation Lightning Talk (Related Program: DRBE, SC2, Colosseum)
Dr. John Davies, DARPA

Chip Scale Filters Lightning Talk
Dr. Ben Griffin, DARPA

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2020: Day 1 Welcome and Introductory Remarks and Fireside Chat

Welcome and Introductory Remarks
Dr. Mark Rosker, Director, DARPA Microsystems Technology Office (MTO)
Dr. Peter Highnam, Acting Director, Defense Advanced Research Projects Agency, DARPA
Hon. Michael J.K. Kratsios, Acting Under Secretary of Defense for Research and Engineering (R&E)

Fireside Chat
Mr. Satya Nadella, CEO, Microsoft
Hon. Michael J.K. Kratsios, Acting Under Secretary of Defense for Research and Engineering (R&E)

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Dr. Rich Uhlig, Managing Director, Intel Labs

From Labs to Impact

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Real Time Machine Learning (RTML) – DARPA / NSF Collaboration

Mr. Andreas Olofsson, Program Manager, DARPA MTO
Dr. Sankar Basu, Program Director, National Science Foundation (NSF)

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Future Technology: Software Defined Hardware (SDH)

Dr. David Wentzlaff, Associate Professor of Electrical Engineering, Princeton University

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Circuit Realization at Faster Timescales (CRAFT)

Dr. Linton Salmon, Program Manager, DARPA MTO
Dr. Brucek Khailany, Director of ASIC and VLSI Research, NVIDIA

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Dr. Robert Sadowski, Robotics Senior Research Scientist, U.S. Army TARDEC

Tank Automotive Research, Development and Engineering Center

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Framework for Novel Compute (FRANC)

Dr. Young-Kai Chen, Program Manager, DARPA MTO

Dr. Naresh Shanbhag, Professor of Electrical Engineering, University of Illinois at Urbana-Champaign

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Domain-Specific System on Chip (DSSoC)

Dr. Tom Rondeau, Program Manager, DARPA MTO

Dr. Sarita Adve, Professor of Computer Science, University of Illinois at Urbana-Champaign

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Mr. John Neuffer, President, Semiconductor Industry Association (SIA)

An Industry Perspective on Government Action

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Dr. Praveen Pilly, Senior Researcher, HRL Laboratories

Future Technology: Lifelong Learning Machines (L2M)

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Space Applications / Future Technology: Domain Specific System on Chip (DSSoC)

Dr. Jesse Mee, Deputy Program Manager, Space Electronics Technology, Air Force Research Laboratory (AFRL)

Dr. Mark Horowitz, Professor of Electrical Engineering and Computer Science, Stanford University

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Hierarchical Identify Verify Exploit (HIVE)

Mr. Wade Shen, Program Manager, DARPA I2O / MTO

Dr. Saman Amarasinghe, Professor of Electrical Engineering and Computer Science, MIT

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.

ERI Summit 2019: Dr. Ilan Gur, Executive Director, Cyclotron Road

Revitalizing Hard Tech Innovation

Announced in June 2017, the Defense Advanced Research Projects Agency (DARPA) Electronics Resurgence Initiative (ERI) is a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. ERI is forging forward-looking collaborations to enable microelectronics progress through circuit specialization and to ensure secure DoD access to next-generation electronics technologies.

ERI currently encompasses 20 programs—organized into four thrusts—managed by 12 program managers. The 3D heterogeneous integration thrust is enabling tight incorporation of differing circuit components, including through the development of the first state of the art electrical interface standard supported by an open source reference design. The novel materials and devices thrust is delivering new materials technologies to the domestic manufacturing base, demonstrating the first commercial manufacture of resistive RAM devices integrated with carbon nanotube transistors in a silicon compatible process. The design and security thrust is accelerating delivery of specialized circuitry and creating new opportunities for the safe use of open-source IP, recently showing that unknown chip design flaws can be rapidly located. The specialization thrust is optimizing systems for commercial and defense functions, such as driving towards ASIC-level performance in runtime programmable processors. Building on the tradition of successful government-industry partnerships, these and other ERI programs will enable the United States to collaboratively innovate a 4th wave of microelectronics progress and to create a more specialized, secure, and heavily automated electronics industry that meets national defense and commercial needs.

Visit www.eri-summit.com for more details on the ERI Summit, including slide downloads.