ERI Summit 2020: Heterogeneous 3D Microsystems: Design, Fabrication, and Packaging

Plenary Speaker
Dr. Philip Wong, Vice President of Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC); Professor, Stanford

Co-packaging Heterogeneous Microelectronics and Optical Input/Output (Related Programs: CHIPS, PIPES, Navy: SHIP)
Dr. Gordon Keeler; DARPA
Mr. Sergey Shumarayev, Intel
Dr. Mark Wade, Ayar Labs
Mr. Brett Hamilton, Naval Surface Warfare Center (NSWC) Crane

3D Heterogeneous Integration and the Future of Data-Centric Computing (Related Program: 3DSoC)
Dr. Jason Woo, University of California Los Angeles
Dr. Max Shulaker, Massachusetts Institute of Technology

CMOS-Like Heterogeneous Integration Lightning Talk
Dr. Tom Kazior, DARPA

Visit https://eri-summit.darpa.mil/ for more details on the ERI Summit, including slide downloads.